PCB Fabrication

 Products and Services
Topscom has the ability to build virtually all multilayer board designs produced.

Multilayer Technologies

QTA and Prototyping

High Performance Materials

MCM/Substrates

Microvia

Backpanels

Capabilities

Technology Roadmap

Engineering Services

Surface Finishes

Product Development

Production Equipment

Research and Development

Front End Capabilities

Analytical Services

 Materials
Topscom has extensive experience with materials, ranging from mid-range FR-4 to Polyimide, Teflon, Cynate Ester and BT. Hybrid application for complex RF, Microwave, and Antenna products are our specialty. The use of High Tg, Low loss ‘s High speed Dielectrics is growing with the increasing functionality and speed for the character, voice and image path transition.  Topscom can provide alternative solutions for hard to find materials based on desired electrical performance requirements.

Materials Chart

Buried Capacitance

Hybrid Applications