Assembly:

Topscom's roots lie in the assembly and testing of printed circuit boards. Today,we support high and low-mix PCB and backplane assembly for volumes that range from just a few units for prototypes, to modest quantities for pre-production, to hundreds of thousands in volume production.

Our assembly services are complemented by front-end product development capabilities including strong CAD layout and design experience. And of course, quality is always first - we employ DFX fundamentals as well as quality and data-tracking methodologies.

PCB Capabilities 
·                       0201s 
·                       CCGA 
·                       COB 
·                       CSPs 
·                       Double sided, mirrored BGA assembly 
·                       Double sided, single reflow processing 
·                       Fine pitch high pin count press fit connectors 
·                       Flip chip 
·                       Lead-free assembly 
·                       MCMs 
·                       MEMs 
·                       Mictor connectors 
·                       uBGA 
·                       Bare die attach 
·                       Continuous flow SMT lines 
·                       Optical splicing
·                       Backplane Capabilities

·                       SMT - large scale backplanes up to 24" x 24" 
·                       PTH (plated through hole) - up to 24" wide 
·                       Press-fit - up to 12 ton, closed-loop systems 
·                       Process chemistry - aqueous and no clean 
·                       Test - up to 33,792 test nodes

Plastic Injection Workshop

Metal Stamping Workshop

SMT Workshop

Burn-In Room