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Flip Chip Technologies
0201 Technology
 Lead-Free Solder
Alternative PCB Finishes
Assembly





　

Flip Chip Technologies

　

Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:

  • Solder Bumped Flip Chip Technology

  • Anisotropic Conductive Adhesive Flip Chip Technology

  • Ultrasonic Bonding Flip Chip Technology

 

In addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.

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