|
Topscom integrates quality ISO certified
systems and innovative assembly and packaging technologies to
deliver market-leading consumer electronic products. From product
assembly through enclosures to testing and packaging, Topscom’s
SMT lines utilize the most advanced technologies in the industry
including:
Flip Chip Technologies
0201 Technology
Lead-Free Solder Technology
Alternative PCB Finishes
Early supplier involvement
Design and engineering support
PCB and PCB assembly
Backplane assembly
Memory and optical modules
Cable and harness assembly
Plastic injection molding
Precision machining
Enclosures
Integration of hardware and software
BTO and CTO services according to your needs
Reliability testing
Lean and Six Sigma quality processes |